Flexible vibration film and display having the same

ABSTRACT

The present disclosure relates to a flexible vibration film and a display apparatus having the same. A flexible vibration film includes: a vibration layer; a first electrode layer disposed on a bottom surface of the vibration layer; and a second electrode layer disposed on a top surface of the vibration layer, wherein the vibration layer includes: a first vibration unit having a first vibration characteristics; a second vibration unit having a second vibration characteristics; and a flexible insulating part disposed between the first vibration unit and the second vibration unit, and wherein the first electrode layer includes: a first part corresponding to the first vibration unit; and a second part corresponding to the second vibration unit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority benefit of the Korean PatentApplication No. 10-2019-0179559 filed in the Republic of Korea on Dec.31, 2019, the entire contents of which is hereby expressly incorporatedby reference as if fully set forth herein into the present application.

BACKGROUND Technical Field

The present disclosure relates to a flexible vibration film and adisplay apparatus having the same, and more particularly to anintegrating type flexible vibration film for generating different soundsand vibrations distinguished in accordance with the sectors by using aflexible vibration module, and a display including the same flexiblevibration film.

Discussion of the Related Art

The display is a device having a display panel for representing variousvideo data and a speaker for providing the sound information. Wheninstalling the speakers with the display, a space for speaker should beensured so that the design and space arrangement for the display may berestricted.

For example, the speaker may be an actuator including a magnet and coil.When applying the actuator into the display, there is a disadvantagethat the thickness should be thick for ensuring a space for actuator. Inorder to ensure the display to be thin condition, a piezoelectricelement implementing thin thickness is used.

The piezoelectric elements are brittle and are easily damaged from theexternal impacts, and there may be a problem in which the reliability ofsound production is degraded.

SUMMARY

Accordingly, embodiments of the present disclosure are directed to aflexible vibration film and a display having the same that substantiallyobviates one or more of the problems due to limitations anddisadvantages of the related art.

One aspect of the present disclosure for overcoming the problems ofrelated arts is to suggest a vibration element implemented withexcellent flexibility and ultra-thin type of speaker, receiver,microphone and haptic elements, and a display including this vibrationelement. Another aspect of the present disclosure is to suggest anintegrated type flexible vibration film implemented in one filmstructure including a plurality of vibration elements for speaker,receiver, microphone and haptic elements, and to suggest a display panelincluding this intergrated type flexible vibration film. Still anotheraspect of the present disclosure is to suggest an integrated flexiblevibration film including one flexible film element implemented with aplurality of vibration elements specified in accordance with thevibration characteristics of the speaker, receiver, microphone andhaptic element, and to suggest a display panel including the same.

Additional features and aspects will be set forth in the descriptionthat follows, and in part will be apparent from the description, or maybe learned by practice of the inventive concepts provided herein. Otherfeatures and aspects of the inventive concepts may be realized andattained by the structure particularly pointed out in the writtendescription, or derivable therefrom, and the claims hereof as well asthe appended drawings.

To achieve these and other aspects of the inventive concepts, asembodied and broadly described, a flexible vibration film comprises: avibration layer; a first electrode layer disposed on a bottom surface ofthe vibration layer; and a second electrode layer disposed on a topsurface of the vibration layer, wherein the vibration layer includes: afirst vibration unit having a first vibration characteristics; a secondvibration unit having a second vibration characteristics; and a flexibleinsulating part disposed between the first vibration unit and the secondvibration unit, and wherein the first electrode layer includes: a firstpart corresponding to the first vibration unit; and a second partcorresponding to the second vibration unit.

In one embodiment, the flexible vibration film further comprises: afirst protective layer covering the first electrode layer; and a secondprotective layer covering the second electrode layer.

In one embodiment, the first vibration unit includes: a plurality offirst piezoelectric parts having a first width; and a plurality of firstinsulating parts between each of the plurality of the firstpiezoelectric parts. The second vibration unit includes: a plurality ofsecond piezoelectric parts having a second width; and a plurality ofsecond insulating parts between each of the plurality of the secondpiezoelectric parts.

In one embodiment, the first piezoelectric parts and the secondpiezoelectric parts include an inorganic material; and the firstinsulating part and the second insulating part include an organicmaterial.

In one embodiment, the plurality of the first piezoelectric parts, theplurality of the insulating parts, the plurality of the secondpiezoelectric parts and the plurality of the second insulating parts arearranged side by side on a same plane; and the first piezoelectric partshave different size from the second piezoelectric parts.

In one embodiment, the vibration layer further includes a thirdvibration unit having a third vibration characteristics; and theflexible insulating part is disposed among the first vibration unit, thesecond vibration unit and the third vibration unit.

In one embodiment, the flexible vibration film further comprises: afirst signal line connected to the first electrode part, disposed on theflexible insulating part and extended to an end side of the vibrationlayer; and a second signal line connected to the second electrode part,disposed on the flexible insulating part and extended to the end side ofthe vibration layer.

In one embodiment, the first vibration unit and the second vibrationunit divided in a plurality of sectors; and the sectors of the firstvibration unit and the sectors of the second vibration unit arealternately arrayed.

In one embodiment, the first vibration unit provides a sound wave of 300Hz to 20,000 Hz; and the second vibration unit provides a vibration waveof 60 Hz to 280 Hz.

In one embodiment, the first vibration unit provides a sound wave of 300Hz to 20,000 Hz; and the second vibration unit provides any one of thesound wave of 300 Hz to 20,000 Hz and a vibration wave of 60 Hz to 280Hz.

In another aspect, a flexible vibration film comprises: a vibrationlayer including a first vibration unit, a second vibration unit and aflexible insulating part between the first vibration unit and the secondvibration unit; an upper electrode layer including a first electrode onthe first vibration unit and a second electrode on the second vibrationunit; a lower electrode layer disposed on a bottom surface of thevibration layer; an upper protective layer covering the upper electrodelayer; and a lower protective layer covering the lower electrode layer.

In one embodiment, the first vibration unit includes: a plurality offirst piezoelectric parts having a first width; and a plurality of firstinsulating parts among the plurality of the first piezoelectric parts.The second vibration unit includes: a plurality of second piezoelectricparts having a second width; and a plurality of second insulating partsamong the plurality of the second piezoelectric parts.

In one embodiment, the plurality of the first piezoelectric parts, theplurality of the first insulating parts, the plurality of the secondpiezoelectric parts and the plurality of the second insulating parts arearranged side by side on a same plane; and the first piezoelectric partshave different size from the second piezoelectric parts.

In one embodiment, the flexible vibration film further comprises: afirst signal line connected to the first electrode, disposed on theflexible insulating layer and extended to an end side of the vibrationlayer; and a second signal line connected to the second electrode,disposed on the flexible insulating layer and extended to the end sideof the vibration layer.

In one embodiment, the first vibration unit and the second vibrationunit are divided into a plurality of sectors; and the plurality ofsectors of the first vibration unit and the second vibration unit arealternately arranged.

In one embodiment, the first vibration unit provides a sound wave of 300Hz to 20,000 Hz; and the second vibration unit provides any one of thesound wave of 300 Hz to 20,000 Hz and a vibration wave of 60 Hz to 280Hz.

In another aspect, a display comprises: a flexible vibration film; asubstrate on an surface of the flexible vibration film; an emissionlayer on the substrate; an encapsulation layer on the emission layer; acover plate on the encapsulation layer; and a middle frame on anopposite surface of the flexible vibration film. The flexible vibrationfilm comprises: a vibration layer; a first electrode layer disposed on abottom surface of the vibration layer; and a second electrode layerdisposed on a top surface of the vibration layer, wherein the vibrationlayer includes: a first vibration unit having a first vibrationcharacteristics; a second vibration unit having a second vibrationcharacteristics; and a flexible insulating part disposed between thefirst vibration unit and the second vibration unit, and wherein thefirst electrode layer includes: a first part corresponding to the firstvibration unit; and a second part corresponding to the second vibrationunit.

According to the present disclosure, it may provide a flexible vibrationfilm which may have an excellent sound pressure characteristics andsound positioning characteristics, an excellent flexibility and asuperior resistance to the external impacts. Applying the flexiblevibration film according to the present disclosure, it may provide adisplay with enhanced reliability and improved customer satisfaction.

According to the present disclosure, by implementing a plurality of thinfilm type vibration elements having vibration characteristicsspecialized for speakers, receivers, microphones and haptic elements inthe form of one flexible film, one integrated flexible vibration filmmay be manufactured. Using the integrated flexible vibration filmaccording to the present disclosure, an ultra-thin, ultra-lightweightdisplay may be provided as having various vibration functions. Further,a flexible display embedding or including a speaker, a microphone and/orhaptic element.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the inventive concepts asclaimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiments of the disclosure andtogether with the description serve to explain principles of thedisclosure. In the drawings:

FIG. 1 is a plan view illustrating a display including an integratedtype flexible vibration film according to the first embodiment of thepresent disclosure.

FIG. 2 is a cross-sectional view illustrating a structure of a displayincluding an integrated type flexible vibration film according to thefirst embodiment of the present disclosure.

FIG. 3 is a cross-sectional view, along the cutting line I-I′ in FIG. 1, illustrating a structure of an integrated type flexible vibration filmaccording to the first embodiment of the present disclosure.

FIG. 4 is a perspective view illustrating a structure of a structure ofan integrated type flexible vibration film according to the firstembodiment of the present disclosure.

FIG. 5 is a plan view illustrating a structure of a first vibration unitaccording to the first embodiment of the present disclosure.

FIG. 6 is a plan view illustrating a structure of a second vibrationunit according to the first embodiment of the present disclosure.

FIG. 7 is a plan view illustrating a structure of a third vibration unitaccording to the first embodiment of the present disclosure.

FIG. 8 is a plan view illustrating a structure of a fourth vibrationunit according to the first embodiment of the present disclosure.

FIG. 9 is a plan view illustrating a display including an integratedtype flexible vibration film according to the second embodiment of thepresent disclosure.

FIG. 10 is a plan view illustrating a display including an integratedtype flexible vibration film according to the third embodiment of thepresent disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.In the specification, it should be noted that like reference numeralsalready used to denote like elements in other drawings are used forelements wherever possible. In the following description, when afunction and a configuration known to those skilled in the art areirrelevant to the essential configuration of the present disclosure,their detailed descriptions will be omitted. The terms described in thespecification should be understood as follows. Advantages and featuresof the present disclosure, and implementation methods thereof will beclarified through following embodiments described with reference to theaccompanying drawings. The present disclosure may, however, be embodiedin different forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the present disclosure to those skilled in the art.Further, the present disclosure is only defined by scopes of claims.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure the important point of the present disclosure, thedetailed description will be omitted.

In the case that “comprise,” “have,” and “include” described in thepresent specification are used, another part may also be present unless“only” is used. The terms in a singular form may include plural formsunless noted to the contrary.

In construing an element, the element is construed as including an errorrange although there is no explicit description.

In describing a positional relationship, for example, when thepositional order is described as “on,” “above,” “below,” and “next,” thecase of no contact there-between may be included, unless “just” or“direct” is used. If it is mentioned that a first element is positioned“on” a second element, it does not mean that the first element isessentially positioned above the second element in the figure. The upperpart and the lower part of an object concerned may be changed dependingon the orientation of the object. Consequently, the case in which afirst element is positioned “on” a second element includes the case inwhich the first element is positioned “below” the second element as wellas the case in which the first element is positioned “above” the secondelement in the figure or in an actual configuration.

In describing a temporal relationship, for example, when the temporalorder is described as “after,” “subsequent,” “next,” and “before,” acase which is not continuous may be included, unless “just” or “direct”is used.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

In describing the elements of the present disclosure, terms such as thefirst, the second, A, B, (a) and (b) may be used. These terms are onlyto distinguish the elements from other elements, and the terms are notlimited in nature, order, sequence or number of the elements. When anelement is described as being “linked”, “coupled” or “connected” toanother element that element may be directly connected to or connectedto that other element, but indirectly unless otherwise specified. It isto be understood that other elements may be “interposed” between eachelement that may be connected to or coupled to.

It should be understood that the term “at least one” includes allcombinations related with any one item. For example, “at least one amonga first element, a second element and a third element” may include allcombinations of two or more elements selected from the first, second andthird elements as well as each element of the first, second and thirdelements.

Features of various embodiments of the present disclosure may bepartially or overall coupled to or combined with each other, and may bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. The embodiments of thepresent disclosure may be carried out independently from each other, ormay be carried out together in a co-dependent relationship.

The ‘display apparatus’ in this application may comprise a liquidcrystal module (LCM), an organic light emitting display module (OLEDModule), or a quantum dot module (QD Module) which are have a displaypanel and a driver for driving the display panel. The ‘displayapparatus’ may further comprise a complete product or final productincluding LCM, OLED Module or QD Module such as a note-book computer, atelevision set, a computer monitor, an equipment apparatus having anautomotive apparatus or other modules for vehicle, a set electronicapparatus or a set device (or set apparatus) such as a smart phone or amobile electronic apparatus.

Therefore, the ‘display apparatus’ may be any one of a display devicesuch as LCM, OLED Module and QD Module, an application device includingLCM, OLED Module or QD Module, or a set apparatus for end user's finaldevices.

In another example, the LCM, OLED Module or QD Module may be referred tothe ‘display apparatus’, and the final electronic devices including LCM,OLED Module or QD Module may be referred to the ‘set apparatus’. Forexample, the display apparatus may include a display panel of liquidcrystal display or organic electroluminescence display, and a sourceprinted circuit board (PCB) for driving the display panel. The setapparatus may include the display apparatus and a set PCB or control PCBfor driving the set apparatus itself by connecting to the displayapparatus and the source PCB.

The display panel according to the embodiments of the present disclosuremay include a liquid crystal display panel, an organic light emittingdiode display panel, and an electroluminescent display panel, but it isnot limited thereto. For example, display panel may have any structurein which the display panel may be vibrated to generate sound. Inaddition, the display panel applied to the display apparatus accordingto the embodiment of the present disclosure is not limited to the shapeor size of the display panel.

In the case that the display panel is the liquid crystal display panel,the display panel may include a plurality of gate lines, a plurality ofdata lines, and a plurality of pixels (or sub pixels) defined by thegate lines and the data lines. The display panel may include an arraysubstrate including thin film transistor as a switching element forcontrolling the light transmittance of each pixel, an upper substrateincluding a color filter and/or a black matrix, and a liquid crystallayer disposed between the array substrate and the upper substrate.

In the case that the display panel is an organic light emitting diodedisplay panel, the display panel may include a plurality of gate lines,a plurality of data lines, and a plurality of pixels (or sub pixels)defined by the gate lines and the data lines. The display panel mayinclude an array substrate including thin film transistor for applyingthe electric voltage to each pixel selectively, an organic lightemitting layer on the array substrate, and an encapsulation substratedisposed on the array substrate for covering the organic light emittinglayer. The encapsulation substrate may protect the thin film transistorand the organic light emitting layer from any external shocks, andprevent moisture and oxygen from penetrating into the organic lightemitting layer. In addition, the organic light emitting layer formed onthe array substrate may be replaced by the inorganic light emittinglayer, the quantum dot light emitting layer, or the micro light emittingdiode element.

Hereinafter, an example of a display apparatus according to the presentdisclosure will be described in detail with reference to theaccompanying drawings. In designating reference numerals to elements ofeach drawing, the same components may have the same reference numeralsas much as possible even though they are shown in different drawings.Scale of the elements shown in the accompanying drawings have adifferent scale from the actual for convenience of description, it isnot limited to the scale shown in the drawings.

First Embodiment

Hereinafter, referring to FIGS. 1 and 2 , a display including anintegrated type flexible vibration film according to the firstembodiment may be described. FIG. 1 is a plan view illustrating adisplay including an integrated type flexible vibration film accordingto the first embodiment of the present disclosure. FIG. 2 is across-sectional view illustrating a structure of a display including anintegrated type flexible vibration film according to the firstembodiment of the present disclosure.

Referring to FIG. 1 , a display DIS according to a first embodiment ofthe present disclosure may comprise a display area DA and a non-displayarea NDA. The display area DA is a first area for representing the videoinformation, and may be defined as occupying the most of middle portionsof the display DIS. The non-display area NDA is a second area fordisposing a plurality of elements for providing data and/or signal tothe display area DA, as surrounding the display area DA.

In the non-display area NDA, a camera CM and/or an infrared (ray) sensorSE. Even though not shown in figures, a logo or a brand tag may bedisposed in the non-display area NDA.

The display area DA may include a receiver unit REC outputting a callsound, a microphone unit MIC inputting a call sound, a speaker unit SPoutputting sounds of applications, and/or a haptic unit HP providingtactile information. Especially, the receiver unit REC, the microphoneunit MIC, the speaker unit SP and the haptic unit HP may be integratedon one film.

For the case of a personal mobile information device such as a mobilephone, the receiver unit REC may be disposed as corresponding to ear ofthe user. For example, the receiver unit REC may be disposed uppermiddle portion of the display DIS. As the receiver unit REC ispreferably to provide call sound only to individual user, it may have avery small size with a length of about 10 mm and a width of about 2 mm,suitable for protecting personal information.

For the case of a personal mobile information device such as a mobilephone, the microphone unit MIC may be disposed as corresponding to mouthof the user. For example, the microphone unit REC may be disposed lowermiddle portion of the display DIS. As the microphone unit REC ispreferably to collect vibrations generated from the user's voice, it mayhave a size suitable for collecting sounds of various frequenciescovering the audible sound frequencies.

Most of the middle area of the display DIS may be the portions thatdisplays the video image or performs a touch input operation. Thespeaker unit SP and the haptic unit HP may be disposed in the middlearea of the display DIS, as being divided into a plurality of sectors.For example, FIG. 1 shows a structure in which rectangular unit cellsfor speaker unit SP and the haptic unit HP are arranged in a 2×6 matrixmanner. Here, a plurality of sectors for the speaker unit SP and thehaptic unit HP are alternately arranged. However, it is not limitedthereto, the embodiment may be implemented various manners.

The speaker unit SP may be a vibration element generating a sound waveof 200 Hz to 20,000 Hz. The speaker unit SP may directly vibrate thedisplay DIS to output sounds in an audible range to the outside of thedisplay DIS. It is preferable that each sector of the speaker unit SPhas a suitable size to generate and provide the sound waves in variousfrequency ranges.

The haptic unit HP may be a vibration element generating a physicalvibration of 10 Hz to 300 Hz. The haptic unit HP may generate thevibrations in the display DIS itself. When a user touches the displayDIS, the haptic unit HP may provide a tactile feedback to the finger.Further, it may provide the vibrations instead of a phone ring tone orthe vibrations instead of a notification or an alarm.

There may be a frequency range overlapping between the vibrationgenerated by the speaker unit SP and the vibration generated by thehaptic unit HP. Considering that the frequency band most sensitive tohaptical vibration is around 250 Hz, it is preferable to form the hapticunit HP to generate vibration in the range of 60 Hz to 280 Hz. Here, thevibration in the range of 60 Hz to 280 Hz generated by the haptic unitHP is actually overlapped with the low-pitched tone range generated inthe speaker unit SP. Therefore, in order to exclude such overlapping, itis preferable that the speaker unit SP may be set to generate the soundvibration in the range of 320 Hz to 20,000 Hz and the haptic unit HP maybe set to generate the haptic vibration in the range of 60 Hz to 280 Hz.

Referring to FIG. 2 , the cross-sectional structure of the displayaccording to the present disclosure will be explained. The display DISaccording to the present disclosure may comprise a substrate SUB, anemission layer EL, an encapsulation layer EN, a cover plate CG, anintegrated flexible vibration film AT, and a middle frame MF.

The substrate SUB may be made of a transparent glass or a transparentplastic material. In the case of a top emission type in which theemission light is provided onto the upper direction of the substrateSUB, the substrate SUB may be made of an opaque metal material. In thecase of the flexible display, the substrate SUB may be made of a thinfilm material having an excellent flexibility.

The emission layer EL may be formed on a top surface of the substrateSUB. The emission layer EL may include a driving element layer such as athin film transistor layer and an emitting element layer such as anorganic light emitting diode layer which are sequentially stacked. Inthis disclosure, more detailed explanation for the emission layer ELwill not be explained.

The encapsulation layer EN may be formed as covering the emission layerEL on the substrate SUB. The encapsulation layer EN is for protectingthe emission layer EL and may have various structures. For an example,the encapsulation layer EN may have a triple layered structure in whicha first inorganic layer, an organic layer and a second inorganic layerare sequentially stacked. For another example, the encapsulation layerEN may be implemented as attaching a glass substrate on the substrateSUB using an optical adhesive.

The cover plate CG may be a protective plate attached on theencapsulation layer EN. The cover plate CG may be a transparent andrigid plate such as a glass plate. The cover plate CG may be atransparent protective film or plate for protecting the encapsulationlayer EN and the emission layer EL from being damaged by any externalimpact or force.

The integrated type flexible vibration film AT may be disposed on thebottom surface of the substrate SUB. The bottom surface is opposited toand parallel with the top surface. For example, the integrated typeflexible vibration film AT may be attached on the bottom surface of thesubstrate SUB using an adhesive layer. The integrated type flexiblevibration film AT may be an element for directly providing thevibrations to the substrate SUB, and the detailed structure of it willbe explained below.

The middle frame MF may be disposed on a bottom surface of theintegrated type flexible vibration film AT. The middle frame MF may bean inserted element for supporting the substrate SUB and the integratedtype flexible vibration film AT. The middle frame MF may be an elementfor linking to an enclosure (not shown in figures) of the display DIS.In some cases, the middle frame MF may be configured to be integratedwith the enclosure.

Hereinafter, referring to FIG. 3 , the detailed structure of theintegrated type flexible vibration film according to the firstembodiment of the present disclosure will be described. FIG. 3 is across-sectional view, along the cutting line I-I′ in FIG. 1 ,illustrating a structure of an integrated type flexible vibration filmaccording to the first embodiment of the present disclosure.

Referring to FIG. 3 , the integrated type flexible vibration film ATaccording to the first embodiment of the present disclosure may comprisea vibration layer EAM, a lower electrode COM, an upper electrode 1000, alower protecting layer and an upper protecting layer PU. The vibrationlayer EAM may include a plurality of vibration units 2010, 2020, 2030and 2040. The vibration layer EAM may further include a flexibleinsulating portion P disposed between each of the vibration units 2010,2020, 2030 and 2040.

The vibration layer EAM may include a receiver unit 2010, a microphoneunit 2020, a plurality of speaker units 2030 and a plurality of hapticunits 2040. The vibration layer EAM may further include a flexibleinsulating portion P disposed as surrounding each of the receiver unit2010, the microphone unit 2020, the speaker unit 2030 and the hapticunit 2040. The receiver unit 2010, the microphone unit 2020, the speakerunits 2030, the haptic units 2040 and the flexible insulating portion Pmay be connected horizontally and arranged side by side on the sameplane.

The lower electrode COM may be deposited as covering the whole surfaceof the vibration layer EAM. The lower electrode COM may include aconductive material such as a metal material or a transparent conductivematerial. When the transparent property is not required, the lowerelectrode COM may be made of a metal material. When the transparentproperty is required, the lower electrode COM may include a metal oxidematerial such as the indium tin oxide (ITO) or the indium zinc oxide(IZO).

The upper electrode 1000 may be formed on the top surface of thevibration layer EAM. Especially, the upper electrode 1000 may be dividedinto a plurality of sectors corresponding to each size of the pluralityof vibration units 2010, 2020, 2030 and 2040 disposed at the vibrationlayer EAM. For example, a receiver electrode 1010 is formed on thereceiver unit 2010, a microphone electrode 1020 is formed on themicrophone unit 2020, each of speaker electrodes 1030 is formed on eachof the speaker units 1020, each of haptic electrodes 1040 is formed oneach of the haptic units 2040. The upper electrode 1000 may be made ofthe same material with the lower electrode COM.

The lower protective layer PD may be deposited on the bottom surface ofthe lower electrode COM. The lower protective layer PD may be to protectthe lower electrode COM. The lower protective layer PD may be made of anorganic insulating material. The upper protective layer PU may bedeposited on the upper surface of the upper electrode 1000. The upperprotective layer PU may be to protect the upper electrode 1000. Theupper protective layer PU may be made of the organic insulating materialsame with the lower protective layer PD.

Hereinafter, referring to FIG. 4 , a structure of an integrated typeflexible vibration film according to the first embodiment of the presentdisclosure will be explained in detail. FIG. 4 is a perspective viewillustrating a structure of a structure of an integrated type flexiblevibration film according to the first embodiment of the presentdisclosure. In FIG. 4 , the stacked structure of the lower electrodeCOM, the vibration layer EAM and the upper electrode 1000 is illustratedas an exploded perspective view.

The lower electrode COM is disposed under the vibration layer EAM. Thelower electrode COM may be deposited on the bottom surface of thevibration layer EAM, as having the same area and shape with thevibration layer EAM.

The vibration layer EAM may include a receiver unit 2010, a microphoneunit 2020, a plurality of speaker units 2030, a plurality of hapticunits 2040, and a flexible insulating portion P disposed as surroundingeach of the vibration units 2010, 2020, 2030 and 2040. The receiver unit2010, the microphone unit 2020, the speaker units 2030, the haptic units2040 and the flexible insulating portion P may be connected horizontallyand arranged side by side on the same plane. Especially, the insulatingportion P may define the whole size of the vibration layer EAM, and theunits 2010, 2020, 2030 and 2040 are arrayed within the flexibleinsulating portion P in a matrix manner.

The upper electrode 1000 may be divided into a plurality of sectorscorresponding to each size of the plurality of vibration units 2010,2020, 2030 and 2040 disposed at the vibration layer EAM. For example,the upper electrode 1000 may include a receiver electrode 1010 formed onthe receiver unit 2010, a microphone electrode 1020 formed on themicrophone unit 2020, each of speaker electrodes 1030 formed on the eachof the speaker units 2030, and each of the haptic electrodes 1040 formedon the each of the haptic units 2040.

Each of the upper electrodes 1010, 1020, 1030 and 1040 is connected toeach of the link lines 4000. The link lines 4000 may be disposed on theflexible insulating layer P as being extended to the non-display areaNDA. For example, the link lines 400 may include a receiver link line4010 connected to the receiver electrode 1010, a microphone link line4020 connected to the microphone electrode 1020, a plurality of speakerlink lines 4030 connected to the plurality of speaker electrodes 1030,and a plurality of haptic link lines 4040 connected to the plurality ofhaptic link electrodes 1040.

A pad portion 3000 may be disposed on the flexible insulating portion Plocated at the non-display area NDA at outskirts of the microphone unit2020. The link lines 4000 may be connected to each of pads 3010, 3020,3030, 3040 disposed at the pad portion 3000. For example, the padportion 3000 may include a receiver pad 3010 connected to the receiverlink line 4010, a microphone pad 3020 connected to the microphone linkline 4020, a plurality of speaker pads 3030 connected to the pluralityof speaker link lines 4030, and a plurality of haptic pads 3040connected to the plurality of haptic link lines 4040. FIG. 4 shows astructure having two columns in which the speaker electrodes 1030 andthe haptic electrodes 1040 are arranged in two columns divided into leftcolumn and right column. In this case, the speaker pads 3030 and thehaptic pads 3040 may be arranged as being grouped into left and rightportions, respectively.

In FIG. 4 , for convenience of description, the lower protective layerPD and the upper protective layer PU are not illustrated.

The vibration units 2010, 2020, 2030 and 2040 may be implemented in theform of a film. The vibration units 2010, 2020, 2030 and 2040 may beexpressed as a sound generating module using the substrate SUB of thedisplay DIS as a vibration plate, a sound generating device, a filmactuator, a film-type piezoelectric composite actuator, a film speaker,and a film-type piezoelectric device, but embodiments are not limitedthereto.

In order to secure piezoelectric properties, the vibration units 2010,2020, 2030 and 2040 may be configured with the piezoelectric ceramics,and a material such as a polymer may be further configured in thepiezoelectric ceramics in order to supplement the impact resistance andto secure the flexibility of the piezoelectric ceramics.

Hereinafter, referring to FIGS. 5 to 7 , each of the vibration unitsaccording to the first embodiment of the present disclosure will bedescribed in detail. FIG. 5 is a plan view illustrating a structure of afirst vibration unit according to the first embodiment of the presentdisclosure. Here, the first vibration unit may be the receiver unit2010.

The receiver unit 2010 may have a rectangular shape including apredetermined width R_(W) and a predetermined length R_(L). However,embodiments are not limited thereto. In another example, the receiverunit 2010 may have an elongated ellipse shape.

The receiver unit 2020 may include a plurality of ceramic parts CEhaving the piezoelectric properties and a plurality of organic filmparts PO having flexibility. Each of ceramic part CE and each of theorganic film part PO may be alternately arranged. The ceramic parts CEmay include an electro active material.

Each of the organic film parts PO may be disposed between each of theceramic parts CE. Each of the plurality of ceramic parts CE and theplurality of the organic film parts PO may be disposed (or arranged)parallel to each other on the same plane (or the same layer). Each ofthe organic film parts PO may be configured to fill a gap between twoadjacent ceramic parts CE, thereby being connected to or adhered to theadjacent ceramic part CE. Accordingly, the vibration energy of thereceiver unit 2010 due to the linkage in the unit grid of the ceramicpart CE may be increased by the organic film part PO. Therefore, thepiezoelectric properties and flexibility may be enhanced at the sametime.

The receiver unit 2010 may include a composite film (ororganic-inorganic composite film) having a single-layer structure byalternately arranging the ceramic parts CE and the organic film parts POalong the width direction (Y-axis) on the same plane. The organicmaterial is disposed between the inorganic materials to absorb theimpact applied to the inorganic material (or ceramic part CE) and torelease the stress concentrated on the inorganic material. Accordingly,the receiver unit 2010 may have the enhanced durability.

FIG. 6 is a plan view illustrating a structure of a second vibrationunit according to the first embodiment of the present disclosure. Here,the second vibration unit may be the microphone unit 2020. Themicrophone unit 2020 may not receive an electric signal from themicrophone pad 3020, but converts the vibration generated from themicrophone unit 2020 into an electric signal and supplies it to themicrophone pad 3020. In other words, the microphone unit 2020 may havethe same structure as the receiver unit 2010, but the operation may beopposite.

For example, the receiver unit 2010 may generate the vibration accordingto the variation of the electric potential between the receiver upperelectrode 1010 receiving the electric signal from a controller and thecommon electrode COM. The microphone unit 2020 may be vibrated by theexternal vibration forces, and the electric potential variations areoccurred between the microphone upper electrode 1020 and the commonelectrode COM in accordance with the vibration forces. These electricpotential variations may be converted into the electric signals in thecontroller.

The microphone unit 2020 may have a similar structure with the receiverunit 2010. The receiver unit 2010 may have smaller size than themicrophone unit 2020, so that sounds may not spread to the outside andmay be transmitted only to a user. However, the microphone unit 2020 mayhave a relatively large size so as to receive not only the user's voicebut also sounds within a certain range, or may have a different feature.

In one example, the microphone unit 2020 may include, like the receiverunit 2010, a plurality of ceramic parts CE having the piezoelectricproperties and a plurality of organic film parts PO having theflexibility properties. Each of the plurality of ceramic parts CE andeach of the plurality of organic film parts PO may be alternatelyarranged. The ceramic parts CE may include an electro active material.The ceramic parts CE of the microphone unit 2020 may have wider widthand longer length than the ceramic parts CE of the receiver unit 2010.The microphone unit 2020 may have more numbers of the ceramic parts CEand the organic film parts PO alternately arranged than the receiverunit 2010.

As described above, in order to ensure more privacy protection property,the receiver unit is preferable to have a relative small size because itis for transmitting sound only to the user with small vibrationamplitude. It is preferable that the microphone unit actively receives arelatively wide range of sound bandwidths, so that the microphone unitmay have relatively wide width and long length, or relatively morenumbers of ceramic parts CE and the organic film parts PO.

FIG. 7 is a plan view illustrating a structure of a third vibration unitaccording to the first embodiment of the present disclosure. Here, thethird vibration unit may be the speaker unit 2030. For example, thespeaker unit 2030 may have various shapes such as a square, a circle,and an oval shapes. In FIG. 7 , the speaker unit 2030 is illustrated asa square, for convenience in explain.

The speaker unit 2030 may include a plurality of ceramic parts CE havingthe piezoelectric properties and a plurality of organic film parts POhaving the flexibility properties. Each of the plurality of ceramicparts CE and each of the plurality of organic film part PO may bealternately arranged. The ceramic parts CE may include an electrodeactive material.

The speaker unit 2030 may be a vibration element for generating thesounds by vibrating the substrate SUB. The speaker unit 2030 may be avibration element capable of generating sound waves within human audiblefrequency range of 20 Hz to 20,000 Hz. For example, it may have thestructure as shown in FIG. 5 or FIG. 6 . More preferably, as shown inFIG. 7 , the speaker unit 2030 may have the structure in which thewidths of the ceramic parts CE may be variable so as to be suitable forgenerating sound waves in a wide frequency bands with a considerableoutput amount.

In detail, the speaker unit 2030 may include a ceramic unit CE havingthe widest width (along the X-axis direction) is disposed on the outmostside, and the ceramic units CE having narrower widths are disposedtoward the center area. The organic layer parts PO may have the samewidth and may be disposed between the ceramic parts CE having differentwidths.

FIG. 8 is a plan view illustrating a structure of a fourth vibrationunit according to the first embodiment of the present disclosure. Here,the fourth vibration unit may be the haptic unit 2040. For example, thehaptic unit 2040 may have various shapes such as a square, a circle, andan oval shapes. In FIG. 8 , the haptic unit 2040 is illustrated as asquare, for convenience in explain.

The haptic unit 2040 may include a plurality of ceramic parts CE havingthe piezoelectric properties and a plurality of organic film parts POhaving the flexibility properties. Each of the plurality of ceramicparts CE and each of the plurality of organic film part PO may bealternately arranged. The ceramic parts CE may include an electrodeactive material.

The haptic unit 2040 may be a vibration element for providing thevibration to a user's tactile sense via the substrate SUB. The hapticunit 2040 may be a vibration element capable of generating vibrationswithin range of 60 Hz to 280 Hz suitable for human perception. Forexample, it may have the structure as shown in FIG. 5 or FIG. 6 . Morepreferably, as shown in FIG. 8 , the haptic unit 2040 may have thestructure in which the ceramic parts CE may have relatively wider width(along Y-axis direction) and a length along the X-axis direction. Theorganic parts PO may have relatively narrower width and a length samewith the ceramic parts CE.

The haptic unit 2040 may generate a vibration of 300 Hz or less whichmay overlap with the frequency of the ultra-low range of the sound wavegenerated by the sound unit 2030. Accordingly, the haptic unit 2040 maybe also used as a woofer speaker for providing the ultra-low pitchedsounds as operating with the speaker unit 2030, not only for hapticoperation.

The vibration units 2010, 2020, 2030 and 2040 shown in FIGS. 5 to 8 mayhave the similar structure. There may be differences suitable forapplicable function or features. For the case of large amplitude and lowfrequency, it is preferable that the ceramic parts CE, main element forgenerating vibrations, may have relatively long length. For the casethat the shape of vibration unit has a shape of which long length is onX-axis and short length is on Y-axis, the long side of the ceramic partsCE may be disposed on the X-axis. For another example of small amplitudeand high frequency, it is preferable that ceramic parts CE may beconfigured to have relatively short length. For the case that the shapeof vibration unit has a shape of which long length is on X-axis andshort length is on Y-axis, the long side of the ceramic parts CE may bedisposed on the Y-axis. According to the intensity of the vibration, theceramic CE may be set as to be longer or shorter. When the width iswider the vibration may be strong but may be soft. When the width isnarrower, the vibration may be weak but may be sharp. Hereinafter, thecommonly applied features may be explained below.

The vibration units 2010, 2020, 2030 and 2040 may have a structure inwhich a plurality of ceramic parts CE and a plurality of organic filmparts PO are alternately arranged. The ceramic parts CE may be made ofan electro active material. The electro active material have thecharacteristics in which when a pressure force or a twisting force isapplied on the crystal structure due to an external force, a potentialdifference occurs due to dielectric polarization according to a changein the relative position of positive (+) ions and negative (−) ions. Onthe other hands, when an electric voltage is applied to the electroactive material, the electro active material may generate a vibrationcorresponding to the electric field formed by the electric voltage.

Each of the plurality of organic film parts PO may be disposed as beingalternately with each of the plurality of ceramic parts CE. Theplurality of ceramic parts CE and the plurality of organic film parts POmay be disposed (or arranged) parallel to each other on the same plane(or the same layer). Each of the organic film parts PO may be configuredto fill a gap between two adjacent ceramic parts CE, thereby beingconnected to or adhered to the adjacent ceramic part CE. Accordingly,the vibration energy of the vibration units 2010, 2020, 2030 and 2040due to the linkage in the unit grid of the ceramic part CE may beincreased by the organic film part PO. As the vibration units 2010,2020, 2030 and 2040 may be configured to be one composite film (ororganic-inorganic composite film) having a single-layer structure byalternately arranging the ceramic parts CE and the organic film parts POalong the width direction (Y-axis) on the same plane.

The plurality of organic film parts PO may be made of the organicmaterial, and arranged between two ceramic parts CE including theinorganic material. The organic material is disposed between theinorganic materials to absorb the impact applied to the inorganicmaterial (or ceramic part CE) and to release the stress concentrated onthe inorganic material. Accordingly, the receiver unit 2010 may have theenhanced durability.

The plurality of organic film parts PO may provide the flexibility tothe vibration units 2010, 2020, 2030 and 2040. As ensuring theflexibility, the vibration units 2010, 2020, 2030 and 2040 may be bentas to have a shape matched to the shape of the substrate SUB of thedisplay DIS. For example, when the display DIS is a flexible or rollabledisplay, the vibration units 2010, 2020, 2030 and 2040 may be bent orrolled as the substrate SUB is bent or rolled. The vibration units 2010,2020, 2030 and 2040 may provide the vibration to the substrate SUBaccording to the electric signal. For an example, the vibration units2010, 2020, 2030 and 2040 may be vibrated in accordance with the voicesignal synchronized with the video represented on the display DIS tovibrate the substrate SUB. For another example, the vibration units2010, 2020, 2030 and 2040 may be vibrated in accordance with the hapticfeed back signal (or tactile feed back signal) synchronized with thetouch operation of the user on the touch panel (or touch sensor layer)embedded into or disposed onto the emission layer EL. Accordingly, thesubstrate SUB of the display DIS may provide at least one of sounds andhaptic vibration to the user in accordance with the vibration of thevibration units 2010, 2020, 2030 and 2040.

In addition, as the flexible vibration film according to the presentdisclosure may include the inorganic material (ceramic parts) and theorganic material (organic film parts) on the same layer, the externalimpact to the inorganic material may be absorbed by the organicmaterial. Further, the damages on the inorganic material and thedegradation of vibration property (or degradation of sound property) dueto the damage from the external impact applied to the display may beminimized or prevented.

The flexible vibration film according to the present disclosure may havea structure in which a plurality of vibration units is arrayed withinthe insulating parts on the same leveled plane. Therefore, differencesdue to the vibration characteristics between each vibration unit may notinterfere with each other, so that the vibration characteristics may beensured independently. Further, the flexibility may be ensured inmaximum condition, so that an ultra-thin vibration element may beprovided for the flexible display. For the case of flexible display, itmay be very hard to implement to include the speaker system inaccordance with the conventional arts. However, according to the presentdisclosure, a flexible display having the receiver, the speaker, thehaptic element and the microphone may be integrated with the flexibledisplay.

Second Embodiment

Hereinafter, referring to FIG. 9 , the second embodiment of the presentdisclosure will be explained. FIG. 9 is a plan view illustrating adisplay including an integrated type flexible vibration film accordingto the second embodiment of the present disclosure. FIG. 9 shows thecase in which the integrated type flexible vibration film according tothe second embodiment is applied to the personal information processingdevice such as the tablet personal computer.

The display including an integrated type flexible vibration filmaccording to the second embodiment of the present disclosure may havevery similar structure with the first embodiment. The difference is onthe shape and arrangement of the vibration units configuring theintegrated type flexible vibration film.

The second embodiment may provide a structure suitable for the displayelement of the tablet personal computer which may be used in theportrait status or in the landscape status in accordance with the usedpurpose such as writing a document using the on-screen keyboard.

For example, the tablet personal computer may have a phone function likethe mobile phones. Therefore, the receiver unit REC may be disposed atthe upper middle portion of the display DIS and the microphone unit MICmay be disposed at the lower middle portion of the display DIS in theportrait status. In addition, under the portrait status, the speakerunit SP may be disposed at the left column and the haptic unit HP may bedisposed at the right column. Here, the haptic unit HP may be preferablydisposed at the position where the on-screen keyboard may be appearedwhen the display DIS is turn to landscape status.

FIG. 9 illustrates the case in which the haptic unit HP is disposed atlower portion when rotating the display DIS to 90 degree to leftdirection (or countclock direction). The speaker unit SP may be disposedat the upper portion. In addition, when the display DIS is under thelandscape status, the speaker unit SP may include a left speaker unitSPL and a right speaker unit SPR which are separately disposed. Further,a center speaker unit SPC may be included between the left speaker unitSPL and the right speaker unit SPR.

Third Embodiment

Hereinafter, referring to FIG. 10 , the third embodiment of the presentdisclosure will be explained. FIG. 10 is a plan view illustrating adisplay including an integrated type flexible vibration film accordingto the third embodiment of the present disclosure.

In the third embodiment, the speaker units SP and the haptic units HPmay have a small size and alternately arrayed in a matrix manner withinthe display area DA. Each of the haptic units HP may have a square shapecorresponding to the contact area with the humans finger tip, so as toconfigure to provide the feed back vibration signal in accordance withthe touch operation of the user.

In one example, the haptic units HP may be arrayed in a matrix manner inwhich each of squares are disposed with a predetermined distance fromeach other. In this case, the speaker units SP may have ‘+’ shape, andevery one speaker unit SP may be disposed between each of haptic unitsHP.

Under this structure, when inputting character or number using theon-screen keyboard or key-pad, a vibration signal to feed back whetherthe key is input or not may be provided through the haptic unit HPdisposed corresponding position of the key whenever the key is pressedor touched.

In another embodiment, by providing a higher frequency vibration to thehaptic unit HP arranged at the ‘F’ key and the T key position toacknowledge the reference position of the key arrangement on the screenkeyboard, it is possible to recognize whether the finger is in thecorrect position or not by tactile sense as placing the fingers on thescreen keyboard.

The speaker unit SP may provide various sound effects including stereosound effects by dividing each screen area into a left speaker unit, aright speaker unit and a center speaker unit. Further, the haptic unitHP may also be used as a woofer speaker unit by outputting a signal inan ultra-low pitched sound of 200 Ha or lower. When the haptic unit HPis operated together with the woofer speaker function, the haptic unitHP may include the electrode formed of the high specific gravitymaterials such as lead (Pb) and zirconium-titanium oxide (ZrTiO3)including higher contents than the speaker unit SP or receiver unit REC.

As the vibration units may be disposed in various manners like describedin the embodiments of the present disclosure, it may be possible toimplement an integrated flexible vibration film that has receiver,speaker, microphone and/or haptic functions in a single film accordingto the application field and specifications of the product. According tothe present disclosure, most of all functions based on vibrationcharacteristics may be provided with one integrated flexible vibrationfilm without additional equipment such as receivers, speakers andmicrophones consisting of coil and magnet and eccentric motors whichtake up significant volume. The integrated flexible vibration filmaccording to the present disclosure may be implemented in ultra-thintype and have excellent flexibility, so it may be applied to a flexibledisplay. In addition, it may be implemented an ultra-thin andultra-light weight display.

Features, structures, effects and so on described in the above describedexamples of the present disclosure are included in at least one exampleof the present disclosure, and are not necessarily limited to only oneexample. Furthermore, features, structures, effects and so onexemplified in at least one example of the present disclosure may beimplemented by combining or modifying other examples by a person havingordinary skilled in this field. Therefore, contents related to suchcombinations and modifications should be interpreted as being includedin the scope of the present application.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the flexible vibration filmand the display of the present disclosure without departing from thespirit or scope of the disclosures. Thus, it is intended that thepresent disclosure covers the modifications and variations of thisdisclosure provided they come within the scope of the appended claimsand their equivalents. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

What is claimed is:
 1. A flexible vibration film, comprising: a vibration layer; a first electrode layer disposed on a first surface of the vibration layer; and a second electrode layer disposed on a second surface of the vibration layer, wherein the vibration layer includes: a first vibration unit having a first vibration characteristics; a second vibration unit having a second vibration characteristics; and a flexible insulating part disposed between the first vibration unit and the second vibration unit, wherein the first electrode layer includes: a first part corresponding to the first vibration unit; and a second part corresponding to the second vibration unit, wherein the first vibration unit includes: a plurality of first piezoelectric parts having a first width; and a plurality of first insulating parts between each of the plurality of the first piezoelectric parts, and wherein the second vibration unit includes: a plurality of second piezoelectric parts having a second width; and a plurality of second insulating parts between each of the plurality of the second piezoelectric parts.
 2. The flexible vibration film according to claim 1, further comprising: a first protective layer covering the first electrode layer; and a second protective layer covering the second electrode layer.
 3. The flexible vibration film according to claim 1, wherein the plurality of the first piezoelectric parts and the plurality of the second piezoelectric parts include an inorganic material, and wherein a first insulating part of the plurality of first insulating parts and a second insulating part of the plurality of second insulating parts include an organic material.
 4. The flexible vibration film according to claim 1, wherein the plurality of the first piezoelectric parts, the plurality of the first insulating parts, the plurality of the second piezoelectric parts and the plurality of the second insulating parts are arranged side by side on a same plane, and wherein the plurality of the first piezoelectric parts have different size from the plurality of the second piezoelectric parts.
 5. The flexible vibration film according to claim 1, wherein the vibration layer further includes a third vibration unit having a third vibration characteristics, and wherein the flexible insulating part is disposed among the first vibration unit, the second vibration unit and the third vibration unit.
 6. The flexible vibration film according to claim 1, further comprising: a first signal line connected to a first electrode part, disposed on the flexible insulating part and extended to an end side of the vibration layer; and a second signal line connected to a second electrode part, disposed on the flexible insulating part and extended to the end side of the vibration layer.
 7. The flexible vibration film according to claim 1, wherein the first vibration unit and the second vibration unit divided in a plurality of sectors, and wherein the sectors of the first vibration unit and the sectors of the second vibration unit are alternately arrayed.
 8. The flexible vibration film according to claim 1, wherein the first vibration unit provides a sound wave of 300 Hz to 20,000 Hz, and wherein the second vibration unit provides a vibration wave of 60 Hz to 280 Hz.
 9. The flexible vibration film according to claim 1, wherein the first vibration unit provides a sound wave of 300 Hz to 20,000 Hz, and wherein the second vibration unit provides any one of the sound wave of 300 Hz to 20,000 Hz and a vibration wave of 60 Hz to 280 Hz.
 10. A flexible vibration film, comprising: a vibration layer including a first vibration unit, a second vibration unit and a flexible insulating part between the first vibration unit and the second vibration unit; an upper electrode layer including a first electrode on the first vibration unit and a second electrode on the second vibration unit; a lower electrode layer disposed on a bottom surface of the vibration layer; an upper protective layer covering the upper electrode layer; and a lower protective layer covering the lower electrode layer, wherein the first vibration unit includes: a plurality of first piezoelectric parts having a first width; and a plurality of first insulating parts among the plurality of the first piezoelectric parts, and wherein the second vibration unit includes: a plurality of second piezoelectric parts having a second width; and a plurality of second insulating parts among the plurality of the second piezoelectric parts.
 11. The flexible vibration film according to claim 10, wherein the plurality of the first piezoelectric parts, the plurality of the first insulating parts, the plurality of the second piezoelectric parts and the plurality of the second insulating parts are arranged side by side on a same plane, and wherein the first piezoelectric parts have different size from the second piezoelectric parts.
 12. The flexible vibration film according to claim 10, further comprising: a first signal line connected to the first electrode, disposed on the flexible insulating part and extended to an end side of the vibration layer; and a second signal line connected to the second electrode, disposed on the flexible insulating part and extended to the end side of the vibration layer.
 13. The flexible vibration film according to claim 10, wherein the first vibration unit and the second vibration unit are divided into a plurality of sectors, and wherein the plurality of sectors of the first vibration unit and the second vibration unit are alternately arranged.
 14. The flexible vibration film according to claim 10, wherein the first vibration unit provides a sound wave of 300 Hz to 20,000 Hz, and wherein the second vibration unit provides any one of the sound wave of 300 Hz to 20,000 Hz and a vibration wave of 60 Hz to 280 Hz.
 15. A display, comprising: the flexible vibration film according to the claim 1; a substrate on a surface of the flexible vibration film; an emission layer on the substrate; an encapsulation layer on the emission layer; a cover plate on the encapsulation layer; and a middle frame on an opposite surface of the flexible vibration film. 